Prototype to Mass Production
Quality Guarantee
Full and Partial Turnkey
Industrial equipment
Automotive electronics
Aerospace and defense
LED lighting
Consumer electronics
Medical devices
1. Stencil printingSMT assembly begins with the application of solder paste to the PCB. This is done using a stencil that is placed over the board and aligned with the locations of the components. The solder paste is applied to the stencil and then pushed through the stencil onto the PCB using a squeegee.2. Pick and placeThe next step is to place the components onto the PCB using a pick-and-place machine. This machine uses a vacuum nozzle to pick up each component from a reel or tray and place it onto the PCB in the correct location. The machine can place multiple components simultaneously, increasing efficiency and accuracy.3. Reflow solderingAfter the components are placed on the board, the PCB is placed in a reflow oven. The oven uses heat to melt the solder paste and join the components to the PCB. The oven has several zones with different temperature settings, and the PCB is moved through the zones on a conveyor belt to ensure even heating.4. InspectionOnce the PCB has been soldered, it undergoes several inspections to check for defects or errors. These inspections may include visual inspection, X-ray inspection, and automated optical inspection (AOI).5. Secondary operationsAfter inspection, any necessary secondary operations may be performed, such as trimming excess leads or adding a conformal coating.6. TestingFinally, the assembled PCB is tested to ensure that it functions as intended. This may include functional testing, electrical testing, or other types of testing to ensure that the device meets the required specifications.
Pick and Place Machine
Reflow Oven
Wave Soldering
Solder Paste Application Using SMT Stencil
X-Ray Inspection
AOI
Conformal Coating Service
IC Programming
Functional Testing
SMT PCB Assembly Service
LED PCB Assembly Service
Turnkey PCB Assembly Service
Prototype PCB Assembly Service